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Growth of Nanocrystalline Diamond on W and Ti Films
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 Title & Authors
Growth of Nanocrystalline Diamond on W and Ti Films
Park, Dong-Bae; Myung, Jae-Woo; Na, Bong-Kwon; Kang, Chan Hyoung;
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 Abstract
The growth behavior of nanocrystalline diamond (NCD) film has been studied for three different substrates, i.e. bare Si wafer, 1 thick W and Ti films deposited on Si wafer by DC sputter. The surface roughness values of the substrates measured by AFM were Si < W < Ti. After ultrasonic seeding treatment using nanometer sized diamond powder, surface roughness remained as Si < W < Ti. The contact angles of the substrates were Si () > W () > Ti (). During deposition in the microwave plasma CVD system, NCD particles were formed and evolved to film. For the first 0.5h, the values of NCD particle density were measured as Si < W < Ti. Since the energy barrier for heterogeneous nucleation is proportional to the contact angle of the substrate, the initial nucleus or particle densities are believed to be Si < W < Ti. Meanwhile, the NCD growth rate up to 2 h was W > Si > Ti. In the case of W substrate, NCD particles were coalesced and evolved to the film in the short time of 0.5 h, which could be attributed to the fact that the diffusion of carbon species on W substrate was fast. The slower diffusion of carbon on Si substrate is believed to be the reason for slower film growth than on W substrate. The surface of Ti substrate was observed as a vertically aligned needle shape. The NCD particle formed on the top of a Ti needle should be coalesced with the particle on the nearby needle by carbon diffusion. In this case, the diffusion length is longer than that of Si or W substrate which shows a relatively flat surface. This results in a slow growth rate of NCD on Ti substrate. As deposition time is prolonged, NCD particles grow with carbon species attached from the plasma and coalesce with nearby particles, leaving many voids in NCD/Ti interface. The low adhesion of NCD films on Ti substrate is related to the void structure of NCD/Ti interface.
 Keywords
Nanocrystalline diamond;Microwave plasma CVD;Sputtering;Tungsten;Titanium;Nucleation and growth;Contact angle;
 Language
Korean
 Cited by
1.
철강 위에 SiC 중간층을 사용한 나노결정질 다이아몬드 코팅,명재우;강찬형;

한국표면공학회지, 2014. vol.47. 2, pp.75-80 crossref(new window)
2.
CVD 다이아몬드가 코팅된 알루미늄 방열판의 방열 특성,윤민영;임종환;강찬형;

한국표면공학회지, 2015. vol.48. 6, pp.297-302 crossref(new window)
1.
Nanocrystalline Diamond Coating on Steel with SiC Interlayer, Journal of the Korean institute of surface engineering, 2014, 47, 2, 75  crossref(new windwow)
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Heat Spreading Properties of CVD Diamond Coated Al Heat Sink, Journal of the Korean institute of surface engineering, 2015, 48, 6, 297  crossref(new windwow)
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