Publisher : The Korean Institute of Surface Engineering
DOI : 10.5695/JKISE.2013.46.4.158
Title & Authors
Effects of Chloride Ion on Accelerator and Inhibitor during the Electrolytic Cu Via-Filling Plating Yu, Hyun-Chul; Cho, Jin-Ki;
Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.
R. Kim, J. K. Park, Y. C. Chu, J. P. Jung, Kor. J. Met. Mater., 48 (2010) 667.
M. Lefebvre, G. Allardyce, M. Seita, H, Tsuchida, M. Kusaka, S. Hayashi, Circuit World, 29 (2003) 9.
W. P. Dow et al. Electrochimica Acta, 53 (2008) 3612.
S. S. Ko, J. Y. Lin, Y. Y. Wang, C. C. Wan, Thin Solid Films, 516 (2008) 5046.
M. E. Huerta Garrido, M. D. Pritzker, J. Electrochem. Soc., 155 (2008) D332.
K. Zou, H. Ling, Q. Li, H. Cao. ICEPT-HDP, (2009) 104.
W. P. Dow, M.-Y. Yen, C.-W. Liu, C.-C. Huang, Electrochimica Acta, 53 (2008) 3612.
W. P. Dow, M.-Y. Yen, S.-Z. Liao, Y.-D. Chiu, H.-C. Huang, Electrochimica Acta, 53 (2008) 8231.