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Anti-corrosion Properties of CrN Thin Films Deposited by Inductively Coupled Plasma Assisted Sputter Sublimation for PEMFC Bipolar Plates
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 Title & Authors
Anti-corrosion Properties of CrN Thin Films Deposited by Inductively Coupled Plasma Assisted Sputter Sublimation for PEMFC Bipolar Plates
You, Younggoon; Joo, Junghoon;
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 Abstract
In this study, low-cost, high-speed deposition, excellent processability, high mechanical strength and electrical conductivity, chemical stability and corrosion resistance of stainless steel to meet the obsessive-compulsive (0.1 mm or less) were selected CrN thin film. new price reduction to sputter deposition causes - the possibility of sublimation source for inductively coupled plasma Cr rods were attempts by DC bias. 0.6 Pa Ar inductively coupled plasmas of 2.4 MHz, 500 W, keeping Cr Rod DC bias power 30 W (900 V, 0.02 A) is applied, flow rate of 0.5, 1.0, 1.5 sccm by varying the characteristics of were analyzed. flow rate increases, decreases and , CrN was found to increase. In addition to corrosion resistance and contact resistance, corrosion resistance, electrical conductivity was evaluated. corrosion current density than 0 sccm was sure to rise in all, 1 sccm at (at 0.6 V) , respectively. electrical conductivity process results when 1 sccm 28.8 with the lowest value of the contact resistance was confirmed that came out. The OES (SQ-2000) and QMS (CPM-300) using a reactive deposition process to add to maintain a uniform deposition rate was confirmed that.
 Keywords
Corrosion resistance;Contact resistance;Sublimation;Inductively coupled plasma;
 Language
Korean
 Cited by
1.
Plasma Uniformity Analysis of Inductively Coupled Plasma Assisted Magnetron Sputtering by a 2D Voltage Probe Array,;

Applied Science and Convergence Technology, 2014. vol.23. 4, pp.161-168 crossref(new window)
2.
Numerical Modeling of an Inductively Coupled Plasma Sputter Sublimation Deposition System,;

Applied Science and Convergence Technology, 2014. vol.23. 4, pp.179-186 crossref(new window)
1.
Numerical Modeling of an Inductively Coupled Plasma Sputter Sublimation Deposition System, Applied Science and Convergence Technology, 2014, 23, 4, 179  crossref(new windwow)
2.
Plasma Uniformity Analysis of Inductively Coupled Plasma Assisted Magnetron Sputtering by a 2D Voltage Probe Array, Applied Science and Convergence Technology, 2014, 23, 4, 161  crossref(new windwow)
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