Publisher : The Korean Institute of Surface Engineering
DOI : 10.5695/JKISE.2014.47.1.001
Title & Authors
Study on Characteristics of Electrodeposited Thin Copper Film by Inorganic Additives in Pyrophosphate Copper Plating Bath Koo, Seokbon; Hur, Jinyoung; Lee, Hongkee;
The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. and were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from to . In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).