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Study on Characteristics of Electrodeposited Thin Copper Film by Inorganic Additives in Pyrophosphate Copper Plating Bath
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 Title & Authors
Study on Characteristics of Electrodeposited Thin Copper Film by Inorganic Additives in Pyrophosphate Copper Plating Bath
Koo, Seokbon; Hur, Jinyoung; Lee, Hongkee;
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The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. and were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from to . In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).
Pyrophosphate copper plating;Tensile strength;Crystal plane orientation;Ammonium nitrate;electrodeposition copper foil;Inorganic additives;
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