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Effect of Complexing Agents on Adhesion Strength between Electroless Copper Film and Ta Diffusion Barrier
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 Title & Authors
Effect of Complexing Agents on Adhesion Strength between Electroless Copper Film and Ta Diffusion Barrier
Lee, Chang-Myeon; Jeon, Jun-Mi; Hur, Jin-Young; Lee, Hong-Kee;
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 Abstract
The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle's salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studied in crystal structural point of view.
 Keywords
Electroless copper;Adhesion strength;Residual stress;Electrical resistivity;Complexing agent;
 Language
Korean
 Cited by
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The Effect of Acid Treatment Time for Ni Plating on the Joint of α-Al2O3and Ni Metal, Transactions of the Korean hydrogen and new energy society, 2016, 27, 3, 306  crossref(new windwow)
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