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Palladium-Nickel Alloy Electrodeposition Using Ethylenediamine as Complexing Agent
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 Title & Authors
Palladium-Nickel Alloy Electrodeposition Using Ethylenediamine as Complexing Agent
Choi, Byungha; Sohn, Ho-Sang; Kim, Kyung Tae; Son, Injoon;
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 Abstract
Electrodeposition behaviors of Pd-Ni alloys were investigated from the polarization curves in a solution containing ethylenediamine as complexing agent. The microstructure and hardness of electrodeposited Pd-Ni alloys were also characterized. Codeposition of Pd-Ni alloys was successfully performed in the wide current density ranging from 2 to because the deposition potential of Pd became close to that of Ni in the ethylenediamine-contained solution. It was also found from X-ray diffraction patterns that the solid solution between Pd and Ni was formed with variation of the composition of alloys. The measured hardness of Pd-Ni alloys increased with increasing the contents of Ni due to solid solution strengthening and grain refinement. The electrodeposited Pd-Ni alloys also exhibited a crack free smooth surface morphology from the SEM observation.
 Keywords
Palladium-Nickel Alloy;Electronic Connector;Ethylenediamine;Polarization Curve;Complexing Agent;
 Language
Korean
 Cited by
1.
Ni-Pd 합금 전해도금의 특성에 관한 연구,조은상;정대곤;조진기;

한국표면공학회지, 2015. vol.48. 6, pp.253-259 crossref(new window)
1.
A Study on Characteristics of the Ni-Pd Alloy Electroplating, Journal of the Korean institute of surface engineering, 2015, 48, 6, 253  crossref(new windwow)
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