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Preparation of Conductive Silicone Rubber Sheets by Electroless Nickel Plating
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 Title & Authors
Preparation of Conductive Silicone Rubber Sheets by Electroless Nickel Plating
Lee, Byeong Woo; Lee, Jin Hee;
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Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on flexible silicone rubber are described. The process has been performed using a conventional Ni(P) chemical bath. Additives and complexing agents such as ammonium chloride and glycine were added and the reaction pH was controlled by NaOH aqueous solution. Ni deposition rate and crystallinity have been found to vary with pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity, enhanced adhesion and optimum electric conductivity were formed uniformly on silicone rubber substrates under pH 7 at . The conductive Ni-plated silicone rubber showed a high electromagnetic interference shielding effect in the 400 MHz-1 GHz range.
Electroless plating;Ni plating;Silicone rubber;Electric conductivity;EMI shielding;
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무전해 Ni 도금법을 이용한 전자파 차폐용 도전성 EPDM 고무의 제조,이병우;조수진;양준석;

한국결정성장학회지, 2015. vol.25. 5, pp.193-198 crossref(new window)
Preparation of conductive EPDM rubber sheets by electroless Ni-plating for electromagnetic interference shielding applications, Journal of the Korean Crystal Growth and Crystal Technology, 2015, 25, 5, 193  crossref(new windwow)
J. H. Kim, H. W. Kim, S. M., Park, N. E. Lee, J. Korean Phys. Soc., 52 (2008) 318. crossref(new window)

N. C. Das, D. Khastgir, T. K. Chaki, A. Chakraborty, Composites. 31A (2000) 1069.

K. Sasikumar, G. Suresh, K. A. Thomas, R. John, V. Natarajan,T. Mukundav, R. M. R. Vishnubhatla, Bull. Mater. Sci., 29 (2006) 637. crossref(new window)

Y. Yacubowicz, M. Narkis, Polymer Engin. Sci., 30 (1990) 459. crossref(new window)

D. Li, K. Goodwin, C. L. Yang, J. Mater. Sci., 43 (2008) 7121. crossref(new window)

G. X. Wang, N. Li, H.L. Hu, Y.C. Yu, Appl. Surf. Sci., 253 (2006) 480. crossref(new window)

D. C. Weng, U. Landau, J. Electrochem. Soc., 142(8) (1995) 2598. crossref(new window)

Technical report, Roxtec multi-cable transit devices: Applications and design practices, Roxtec, Sweden, (2014).

S. Rosset, M. Niklaus, P. Dubois, H.R. Shea, Adv. Funct. Mater., 19 (2009) 470. crossref(new window)

I. M. Graz, D. P. J. Cotton, S. P. Lacour, Appl. Phys. Lett., 94 (2009) 071902. crossref(new window)

S. P. Lacour, J. Jones, S. Wagner, T. Li, Z. Suo, Proc. IEEE, 93 (2005) 1459. crossref(new window)

K. G. Keong, W. Sha, S. Malinov, J. Alloys Compd, 334 (2002) 192. crossref(new window)

K. Hagiwara, J. Watanabe, H. Honma, Plating & Surface Finishing, 84(4) (1997) 74.

I. Motizuki, K. Izawa, J. Watanabe, and H. Honma, Trans. IMF, 77 (1999) 41. crossref(new window)

IEEE Std. 299, IEEE Standard Method for Measuring the Effectiveness of Electromagnetic Shielding Enclosure, (1997).