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Electrodeposition of Copper on AZ91 Mg Alloy in Cyanide Solution
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 Title & Authors
Electrodeposition of Copper on AZ91 Mg Alloy in Cyanide Solution
Nguyen, Van Phuong; Park, Min-Sik; Yim, Chang Dong; You, Bong Sun; Moon, Sungmo;
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 Abstract
Copper electrodeposition on AZ91 Mg alloy was studied in views of preferential deposition on - or - phases and how to achieve uniform deposition over the entire surface on - and -phases in a cyanide solution. The inhomogeneous microstructure of AZ91 Mg alloy, particularly - and -phases, was found to result in non-uniform deposition of zincate layer, preferential deposition of zincate on -phases, which leads to non-uniform growth of copper layer during the following electrodeposition process. The preferential depositions of zincate can be attributed to higher cathodic polarizations on the -phases. Pin-hole defects in the copper electrodeposit were observed at the center of large size -phase particles which is ascribed to gas bubbles formed at the -phases. The activation of AZ91 Mg alloy in hydrofluoric acid solution was used to obtain uniform growth of zincate layer on both the - and -phases. By choosing an optimum activation time, a uniform zincate layer was obtained on the AZ91 Mg alloy surface and thereby uniform growth of copper was obtained in a cyanide copper electroplating solution.
 Keywords
Mg alloy;Copper electrodeposition;Zincate layer;
 Language
English
 Cited by
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