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Die Shift Measurement of 300mm Large Diameter Wafer
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 Title & Authors
Die Shift Measurement of 300mm Large Diameter Wafer
Lee, Jae-Hyang; Lee, Hye-Jin; Park, Sung-Jun;
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 Abstract
In today`s semiconductor industry, manufacturing technology is being developed for the purpose of processing large amounts of data and improving the speed of data processing. The packaging process in semiconductor manufacturing is utilized for the purpose of protecting the chips from the external environment and supplying electric power between the terminals. Nowadays, the WLP (Wafer-Level Packaging) process is mainly used in semiconductor manufacturing because of its high productivity. All of the silicon dies on the wafer are subjected to a high pressure and temperature during the molding process, so that die shift and warpage inevitably occur. This phenomenon deteriorates the positioning accuracy in the subsequent re-distribution layer (RDL) process. In this study, in order to minimize the die shift, a vision inspection system is developed to collect the die shift measurement data.
 Keywords
WLP(Wafer Level Package);Die Shift;Warpage;Vision Inspection;
 Language
Korean
 Cited by
 References
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2.
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6.
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