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Designing Electronics for High Frequency Shock
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 Title & Authors
Designing Electronics for High Frequency Shock
Lee, Jong-Hak; Kang, Dong-Seok; Choi, Ji-Ho; Kang, Young-Sik; Lee, Chang-Min;
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In this study, stability designing electronics mounted on launch vehicle for shock load(low/high frequency band) could be derived. For the low-frequency shock loads, CCA(circuit card assembly) has secured the structural integrity over the best natural frequency techniques. For the high-frequency shock load, the structural integrity could be ensured with applying device such as the insulation pad. When the EAR is applied, insulation effect of part application is good more than whole application.
Isolation;Pyrotechnic Shock;Circuit Card Assembly;
 Cited by
Park, J. C., Jeon, Y. D., Jung, W. S., Park, J. J., Cho, K. R., 2006, Simulated Pyroshock Tests of Equipments for KSLV-I Upper Stage, The Korean Society for Aeronautical & Space Sciences Fall Conference, pp. 815~818.

Woo, S. H., Kim, H. B., Moon, S. M., Kim, Y. K. and Kim, K. S., 2006, Shock Separation Test of KOMPSAT-2, Proceedings of the KSNVE Annual Autumn Conference, pp. 1000~1005.

Steinberg, D. S., 2000, Vibration Analysis for Electronic Equipment, John Wiley & Sons Inc., 3rd Edition.

Wijker, J., 2004, Mechanical Vibrations in Spacecraft Design, Springer, pp. 149~200.

NASA-STD-7003, 1999, Pyroshock Test Criteria.