Abstract

The fabrication process and analysis of thermal properties of 50~76vo1% SiCp/Al metal matrix composites(MMCs) for heatsink materials in electronic packaging were investigated. The 50~76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85~170W/mK and coefficient of thermal expansion(CTE) were ranged 10~6ppm1k. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged 115~156W/mK and 6~7ppm/K. respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

Keywords

• pressure infiltration casting process;
• SiCp/Al MMCs;
• thermal conductivity;
• CTE

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