Control of Wafer Temperature Uniformity in Rapid Thermal Processing using an Optimal Iterative teaming Control Technique

최적 반복 학습 제어기법을 이용한 RTP의 웨이퍼 온도균일제어

  • Published : 2000.10.01

Abstract

An iterative learning control technique based on a linear quadratic optimal criterion is proposed for temperature uniformity control of a silicon wafer in rapid thermal processing.