Deformation Properties of Gold Bonding Wire for VLSI Packaging Applications

반도체 패키징용 Gold Bonding Wire의 변형특성 및 해석

  • Kim K. (Korea Advanced Institute of Science and Technology, Dept. of Materials Science and Engineering) ;
  • Hong S. H. (Korea Advanced Institute of Science and Technology, Dept. of Materials Science and Engineering)
  • 김경섭 (한국과학기술원 재료공학과) ;
  • 홍순형 (한국과학기술원 재료공학과)
  • Published : 2001.05.01

Abstract

Mechanical properties of gold bonding wire for VLSI packaging have been studied. The diameters of gold wires are about 20-30 micrometer and fracture loads are 8-20 gram force. The elastic modulus, yield strength, fracture strength and elongation properties have been evaluated by micro-tensile test method. This work discusses for an appropriate selection of micro-force testing system and grip design in mim testing. The best method to determine gauge length of wire and to measure tensile properties has been proposed. The mechanical properties such as strength and elastic modulus of current gold bonding wire are higher than pure those of gold wire.