Inductance Characterization of Bonding Wires for 1-10㎓ Radio Frequency Packages
1-10 ㎓ 초고주파 패키지용 bonding wire 인덕턴스 특성 측정
- Jung, Tae-Ho (Dept. of Electronic Engineering, Sogang University) ;
- Jee, Yong (Dept. of Electronic Engineering, Sogang University)
- Published : 2001.06.01
In this paper, the bonding wire interconnection has been studied from the points of view of modeling and electrical characterization. The bonding wire is measured by TDR(Time Domain Reflectometry) and Network analyzer(1-10㎓). First, one gold bonding wire mounted on 2mm gap substrate measured 3.68nH by TDR and 3.39nH by Network analyzer(6㎓). Two gold bonding wire mounted on 2mm gap substrate measured 3.14nH by TDR and 2.80nH by Network analyzer. This result presented that inductance of bonding wire could be employed as inductors for radio frequency circuit packaging.