Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
Korean Society for Precision Engineering (한국정밀공학회)Photoresist Thermal Reflow Bonding for MEMS Application
감광물질의 열적 reflow를 이용한 MEMS 응용에서의 접합 공정
- Im, S. ;
- Kang, H.W. ;
- Yoon, S.Y. ;
-
Sung, H.J.
- Published : 2011.06.01
Abstract
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Acknowledgement
Supported by : 한국연구재단