Low Temperature Firing Ceramic Substrates for IC Package

저온 소결성 세라믹 기판재료

  • 김정돈 (한국과학기술연구원 기능요업연구실) ;
  • 손용배 (한국과학기술연구원 기능요업연구실) ;
  • 주기태 (한국과학기술연구원 기능요업연구실) ;
  • 장성도 (한국과학기술연구원 기능요업연구실)
  • Published : 1992.02.01


New ceramic substrates firable at low temperature (<1000$^{\circ}C$) were prepared with mixture of alumina and glass powders in CaO-Al2O3-SiO2 system. The substrate of alumina 40 wt% and glass 60 wt%, which was fired between 900∼1000$^{\circ}C$, shows low dielectric constant (5∼8 at 1 MHz), specific gravity of 3.10, relatively low thermal expansion coefficient (5.5${\times}$10-6/$^{\circ}C$ at 40∼500$^{\circ}C$) and excellent surface roughness (0.4∼0.5 ${\mu}$Ra). These properties were thought to be superior to those of conventional Al2O3 ceramic substrates.



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