The Effect of Frit on Bonding Behavior of Low-firing-substate and Cu Conductor

프릿트 첨가에 따른 저온소성 기판과 Cu와의 접합 거동에 관한 연구

  • 박정현 (연세대학교 공과대학 세라믹공학과) ;
  • 이상진 (연세대학교 공과대학 세라믹공학과)
  • Published : 1995.05.01


The bond strength between the low-firing-substrate and Cu conductor depended on the softening point and the amount of frit added to the metal paste. The addition of 3 wt% frit (softening point: 68$0^{\circ}C$) to the metal paste resulted in the improvement of bond strength, which was approximately 3 times higher (3kg/$\textrm{mm}^2$) than that of non frit condition. It was also found that fracture surface shifted to the ceramic substrate in the interface region. These phenomena were attributed to the frit migration into the metal-ceramic interface. It was thought that the migration of glass frit occurred extensively when the softening point of glass firt was 68$0^{\circ}C$. The sheet resistance of Cu conductor remained constant by the addition of 4 wt% frit regardless of softening point of frit. For all samples with more than 4 wt% frit, the sheet resistance increased abruptly.


Low-firing-substrate;Bond strength;Sheet resistance;Interface


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