The Effect of Frit on Bonding Behavior of Low-firing-substate and Cu Conductor

프릿트 첨가에 따른 저온소성 기판과 Cu와의 접합 거동에 관한 연구

  • 박정현 (연세대학교 공과대학 세라믹공학과) ;
  • 이상진 (연세대학교 공과대학 세라믹공학과)
  • Published : 1995.05.01

Abstract

The bond strength between the low-firing-substrate and Cu conductor depended on the softening point and the amount of frit added to the metal paste. The addition of 3 wt% frit (softening point: 68$0^{\circ}C$) to the metal paste resulted in the improvement of bond strength, which was approximately 3 times higher (3kg/$\textrm{mm}^2$) than that of non frit condition. It was also found that fracture surface shifted to the ceramic substrate in the interface region. These phenomena were attributed to the frit migration into the metal-ceramic interface. It was thought that the migration of glass frit occurred extensively when the softening point of glass firt was 68$0^{\circ}C$. The sheet resistance of Cu conductor remained constant by the addition of 4 wt% frit regardless of softening point of frit. For all samples with more than 4 wt% frit, the sheet resistance increased abruptly.

Keywords

Low-firing-substrate;Bond strength;Sheet resistance;Interface

References

  1. Am. Ceram. Soc. Bull. v.71 no.9 Overview of the Glass-Ceramic/Copper Substrate-A High-Performance Multilayer Packing for the 1990's J.U. Kinckerbocker
  2. J. Mater. Sci. v.10 High-Temperature Metallizing Part Ⅰ,Ⅱ M.E. Twentyman;P. Popper
  3. Ceramic Transaction v.20 Applications of Glasses in Thick Film Technology P.W. Bless;R.L. Wahlers;S.J. Stein;K.M. Nair(ed.)
  4. J. Am. Ceram. Soc. v.74 no.5 Ceramic and Glass Ceramic Packaging in the 1990's R.R. Tummala
  5. Ceramic Transaction v.11 Copper Thick Film Adhesion on Glass Ceramic Substrate A. Perecherla;R.C. Buchanan;B.V. Hiremath(ed.)
  6. セラミシク基板とその應用 ニユケラスシリス 偏執委員會
  7. The Properties of Glass G.W. Morey
  8. Advanced in Ceramics v.26 Materials Compatibility and Cosintering Aspects of Shringkage Control in Low-Temperature Cofired Ceramics Packages H.T. Sawhill;M.F. Yan(ed.);K. Niwa(ed.);H.M. O'Bryan, Jr.(ed.);W.S. Young(ed.)
  9. IEEE Trans. Comp Hybrids, Mannf. Tech. v.3 no.2 Thick Film Technology:An Introduction to the Material J.R. Larry;R.M. Rosumberg;R.O.Uhler
  10. Electronic Ceramics Thick-film Technology R.E. Cote;R.J. Bouchard;L.M. Levinson(ed.)
  11. IEEE Trans. Components Hybrids Manuf Tech. v.6 Low Firing Temperature Multilayer Glass-Ceramic Substrate Y. Shimano;K. Utsumi;M. Suzuki;H. Takamizawa;T. Watari
  12. 한국요업학회 v.31 no.4 저온소성 기판과 Cu외의 동시소성에 미치는 CuO의 첨가 효과 박장현;이상진
  13. Chemical Approach to Glass M.B. Volf
  14. Ceramic Transactions v.20 Role of Glass Frit in (Cu) Thick Film Adhesion R.A. Perecherla;R.C. Buchanan;K.M. Nair(ed.)
  15. 한국요업학회 v.29 no.12 알루미나를 충전제로 첨가한 붕규산염 유리의 소결 및 결정화 방지기구에 대한 연구 박장형;이상진;성재식