A Study on Ni Electroless Plating Process for Solder Bump COG Technology

COG용 Solder Bump 제작을 위한 Ni 무전해 도금 공정에 관한 연구

  • 한정인 (전자부품종합기술연구소, 광전부품연구팀)
  • Published : 1995.10.01

Abstract

To connect the driver IC and Al coated glass, a method has been developed to plate electrolessly Ni on Al/PR system. It Is necessary to pretreat Al to remove oxide film before plating. In order to find pretreatment process which does not damage photoresist or glass, alkaline and fluoride zincate process have been investigated. Because photoresist and aluminum thin film can easily dissolve in alkaline solution, it is considered that the fluoride zincate process was a suitable one. After immersion in the zincate solution containing 1.5 g/$\ell$ ammonium bifluoride and 100 g/$\ell$ zinc sulfate, electroless nickel plating could be performed. The additive in the zincate solution and thiourea in the plating solution increased smoothness of the plated surface. Acld dip could improve the uniformit of the surface.

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References

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