This paper aims to clarify the effects of grinding conditions on the grinding force, ground surface and chipping size of workpiece in surface grinding of various ferrites with the resin bond diamond wheel. The main conclusions obtained were as follows: In a constant peripheral wheel speed, the specific grinding energy is fitted by straight lines with grinding depth coefficient($\delta$) in a logarithmic graph. The effect of both depth of cut and workpiece speed on grinding energy becomes larger in the order of Mn-Zn, Cu-Ni-Zn and Sr. When using the diamond grain of the lower toughness, the roughness of the ground surface becomes lower. The ground surfaces show that the fracture process during grinding becomes more brittle in the order of Sr, Mn-Zn and Cu-Ni-Zn. The chipping size at the corner of workpiece in grinding increases with the the increases of the depth of cut and workpiece speed, and the decrease of peripheral wheel speed. The effect of both depth of cut and workpiece speed on chipping size becomes more larger in the order of Sr, Mn-Zn and Cu-Ni-Zn.