Fabrication of passive-aligned optical sub-assembly for optical transceiver using silicon optical bench

실리콘 광학벤치를 사용한 수동정렬형 광송수신기용 광부모듈의 제작

  • Lee, Sang-Hwan (Semiconductor Division, Electronics and Telecommunications Research Institute) ;
  • Joo, Gwan-Chong (Semiconductor Division, Electronics and Telecommunications Research Institute) ;
  • Hwang, nam (Semiconductor Division, Electronics and Telecommunications Research Institute) ;
  • moon, Jong-Tae (Semiconductor Division, Electronics and Telecommunications Research Institute) ;
  • Song, Min-Kyu (Semiconductor Division, Electronics and Telecommunications Research Institute) ;
  • Pyun, Kwang-Eui (Semiconductor Division, Electronics and Telecommunications Research Institute) ;
  • Lee, Yong-Hyun (School of Electronics and Electrical Engineering, Kyungpook National University)
  • 이상환 (한국전자통신연구원 반도체연구단) ;
  • 주관종 (한국전자통신연구원 반도체연구단) ;
  • 황남 (한국전자통신연구원 반도체연구단) ;
  • 문종태 (한국전자통신연구원 반도체연구단) ;
  • 송민규 (한국전자통신연구원 반도체연구단) ;
  • 편광의 (한국전자통신연구원 반도체연구단) ;
  • 이용현 (경북대학교 전자전기공학부)
  • Published : 1997.12.01

Abstract

Packaging takes an extremely important element of optical module cost due primarily to the added complication of alignment between semiconductor devices and optical fiber, and many efforts have been devoted on reducing the cost by eliminating the complicated optical alignment procedures in passive manner. In this study, we fabricated silicon optical benches on which the optical alignments are accomplished passively. To improve the positioning accuracy of a flip-chip bonded LD, we adopted fiducial marks and solder dams which are self-aligned with V-groove etch patterns, and a stand-off to control the height and to improve the heat dissipation of LD. Optical sub-assemblies exhibited an average efficiency of -11.75$\pm$1.75 dB(1$\sigma$) from the LD-to-single mode fiber coupling and an average sensitivity of -35.0$\pm$1.5 dBm from the fiber and photodetector coupling.

Keywords

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