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Thickness Effects of Coupling Agent on Residual Bending Stress in $Polyimide/SiO_2$ Joints

$Polyimide/SiO_2$ 접합체에서 잔류굽힘응력에 미치는 Coupling Agent 두께의 영향

  • 공도일 (포항공과대학교 대학원 화학공학과) ;
  • 박찬언 (포항공과대학교 화학공학과) ;
  • 홍승택 (포항공과대학교 대학원 기계공학과) ;
  • 양훈철 (포항공과대학교 대학원 기계공학과) ;
  • 김기태 (포항공과대학교 기계공학과)
  • Published : 1999.07.01

Abstract

Thickness effects of coupling agent on residual bending stress were investigated in $Polyimide/SiO_2$ joints during thermal cycling. Thickness and peel strength of $\gamma$-APS coupling agent were measured and correlated with solution concentration and residual bending stress. The variation of residual bending stress with temperature was also measured for various thicknesses of the coupling agent. Finite element results were compared with experimental data for residual bending stress in $Polyimide/SiO_2$ joints.

Keywords

Coupling Agent;Electronic Packaging;FEM;Residual Bending Stress;Thickness Effect