Collision Behavior of Molten Metal Droplet with Solid Surface

용융금속 액적의 고체표면 충돌거동

  • 양영수 (전남대학교 기계공학과) ;
  • 손광재 (전남대학교 기계공학과 대학원) ;
  • 강대현 (전남대학교 기계공학과 대학원)
  • Published : 2000.08.01

Abstract

This paper presents a study of the solder bumping process. The theoretical model, based on the variational principle instead of solving the Navier-Stokes equation with moving boundaries, was developed to considered the energy dissipation in semi-solid phase and the approximate solidification time of the molten metal droplet. The simulation results revealed that the developed model could reasonably describe the collision behavior of molten metal with solid surface. Simulations were made with variation of initial droplet temperature, substrate metal and initial substrate temerature.

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