Cure Monitoring of Thick HSPE/Vinylester Composites with Dielectrometry

유전율 분석법에 의한 두꺼운 HSPE/Vinylester 복합재료의 경화 거동 관찰

  • 이승구 (충남대학교 공과대학 섬유공학과) ;
  • 김동철 (충남대학교 공과대학 섬유공학과) ;
  • 주창환 (충남대학교 공과대학 섬유공학과)
  • Published : 2001.05.01

Abstract

HSPE/vinylester 50-ply laminates, thicker than 1 inch, were fabricated by compression molding. To investigate the consolidation procedure of thick HSPE/vinylester composites, a dielectrometric(DEM) cure monitoring with dielectric sensors the thermocouples was utilized. Behaviors of the ion viscosity(a reciprocal of ion conductivity) as a dielectric parameter was monitored and evaluated with the resin viscosity. minimum viscosity temperature and cure temperature were analyzed from the dynamic cure experiments. To obtain the proper compaction of composites, step cure process including an intermediate dwell step at 8$0^{\circ}C$ was set-up to coincide the viscosity window between inner and outer layers of the composite. From the result of DEM analysis, the optimum cure cycle for a thick HSPE/vinylester composite in compression molding was established. In addition, the effects of molding pressure on the properties of composites were evaluated.

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