Development of the Dynamic Photoelastic Hybrid Method for Propagating Interfacial Crack of Isotropic/Orthotropic Bi-materials

등방성/직교이방성 이종재료의 진전 계면균열에 대한 동적 광탄성 실험 하이브리드 법 개발

  • Published : 2001.07.01


When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.


Isotropic/Orthotropic Bi-materials;Dynamic Photoelastic Hybrid Method;Propagating Interfacial Crack;Near-Field Stresses;Dynamic Stress Intensity Factor;Crack Propagating Velocity;Rayleigh Wave Velocity


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