Contact Analysis on a Born-Holder Assembly for Wire Bonding

와이어 본더용 Horn-Holder Assembly의 접촉 해석

  • 장창수 (삼성테크윈 정밀기기연구소) ;
  • 안근식 (삼성테크윈 정밀기기연구소) ;
  • 김영준 (삼성테크윈 정밀기기연구소) ;
  • 곽동옥 (삼성종합기술원 CSE Lab.) ;
  • 부성운 (삼성종합기술원 CSE Lab.)
  • Published : 2002.10.01


Joint structure of a transducer horn-holder assembly fur a wire bonder was examined through FEM contact analysis. A three dimensional modeling and analysis was carried out to survey the internal physics of this structure and to prove the accuracy of a computation compared to a measurement. After validation, a simple two dimensional model was built fur various parametric study considering the efficiency and speed of the computation. Several factors such as boundary conditions, a modeling boundary, mesh density and so on, were considered to obtain consistency with three dimensional analysis. An arc angle and a position of each holder boss were chosen as design parameters. A design of experiment was applied to find out an optimized design of the holder geometry. As a result, a guideline for holder boss design was suggested and main factors and their influence on stress concentration in the transducer horn were surveyed.


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