Contact Analysis on a Born-Holder Assembly for Wire Bonding

와이어 본더용 Horn-Holder Assembly의 접촉 해석

  • 장창수 (삼성테크윈 정밀기기연구소) ;
  • 안근식 (삼성테크윈 정밀기기연구소) ;
  • 김영준 (삼성테크윈 정밀기기연구소) ;
  • 곽동옥 (삼성종합기술원 CSE Lab.) ;
  • 부성운 (삼성종합기술원 CSE Lab.)
  • Published : 2002.10.01


Joint structure of a transducer horn-holder assembly fur a wire bonder was examined through FEM contact analysis. A three dimensional modeling and analysis was carried out to survey the internal physics of this structure and to prove the accuracy of a computation compared to a measurement. After validation, a simple two dimensional model was built fur various parametric study considering the efficiency and speed of the computation. Several factors such as boundary conditions, a modeling boundary, mesh density and so on, were considered to obtain consistency with three dimensional analysis. An arc angle and a position of each holder boss were chosen as design parameters. A design of experiment was applied to find out an optimized design of the holder geometry. As a result, a guideline for holder boss design was suggested and main factors and their influence on stress concentration in the transducer horn were surveyed.


  1. Koduri, S. K., 2000, 'Alignment Apparatus for Wire Bonding Capillary,' US Patent No. 6,065,663
  2. Park, S. H., 1995, Modern Design of Experiments, Minyoung-Sa, Seoul
  3. Peric, D. and Owen, D. R. J., 1992, 'Computational Model for 3-D Contact Problems with Friction Based on the Penalty Method,' Int. J. Num. Meths. Eng., Vol. 35, No. 65
  4. Ahn, K. and Jang, C., 2001, 'Mounting Bracket Structure of Transducer Horn for Wire Bonder,' Korea Patent Application No. 2001-53267
  5. Boo, S. and Kwak, D., 2000, 'Contact Simulation on the Horn Assembly of Wire Bonder,' SAIT Technical Report
  6. Chaudhary, A. and Bathe, K. J., 1986, 'A Solution Method for Static and Dynamic Analysis of Three-Dimensional Contact Problems with Friction,' Compo & Struc., Vol. 24, No.6, p. 855
  7. Or, S. W., Chan, H. L. W., Lo, V. C. and Yuen, C.W., 1998, 'Dynamics of an Ultrasonic Transducer Used for Wire Bonding,' IEEE Trans. on Ultrasonics, Ferroelectrics, and Frequency Control, Vol. 45, No.6, pp. 1453-1460
  8. Hu, C. M., Guo, N. Q. and Ling, S. F., 1998, 'The Vibration Characteristics of Capillary in Wire Bonder,' 1998IEEE/CPMT, pp. 202-205
  9. Zhong, Z. H., 1993, Finite Element Procedures for Contact-Impact Problems, Oxford University Press
  10. Lin, S. and Zhang, F., 1994, 'Study of Vibrational Characteristics for Piezoelectric Sandwich Ultrasonic Transducer,' Ultrasonics, Vol. 32, No.1, pp. 39-2
  11. McBrearty, M., Kim, L. H. and Bilgutay, N. M., 1988, 'Analysis of Impedance Loading in Ultrasonic Transducer System,' Proc. 1988 Ultrasonics Symp., pp 497-502
  12. Harman, G., 1998, Wire Bonding in Microelectronics Materials, Process, Reliability, and Yield, McGraw-Hill, 2nd Ed

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