- Volume 25 Issue 2
High Performance RF Passive Integration on a Si Smart Substrate for Wireless Applications
- Kim, Dong-Wook (Sl Corporation) ;
- Jeong, In-Ho (Telephus Inc.) ;
- Lee, Jung-Soo (Teltron Inc.) ;
- Kwon, Young-Se (Department of Electrical Engineering, Korea Advanced Institute of Science and Technology(KAIST))
- Received : 2002.07.11
- Published : 2003.04.30
To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25
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