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A New Dicing Method for Semiconductor Wafer

반도체 웨이퍼를 위한 새로운 다이싱 방법

  • 차영엽 (원광대학교 기계공학부) ;
  • 최범식 (원광대학교 대학원 기계공학부)
  • Published : 2003.08.01

Abstract

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But products with inferior quality are produced under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO2, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism and determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

Keywords

Scribing Machine;Wafer Dicing;Semiconductor Wafer

References

  1. Cha, Y. Y. and Go, K. Y., 2003, 'Development of scribing machine for dicing of GaN wafer,' Mechatronics : mechanics, electronics, control, Accepted
  2. Chong, C. and Davies, K., 1991, 'Plasma Grooved Buried Contact Silicon Solar Cells,' Appl. Phys. Lett., Vol. 69, No. 4135 https://doi.org/10.1063/1.348429
  3. Cha, Y. Y. and Go, K. Y., 2002, 'Development of scribing machine for dicing of GaN wafer,' Journal of Control Automation and Systems Engineering, Vol. 8, No. 5, pp. 419-424 https://doi.org/10.5302/J.ICROS.2002.8.5.419
  4. Collier, I. T., Gibbs, M. R. J. and Seddon, N., 1992, 'Laser Ablation and Mechanical Scribing in the Amorphous Alloys VAC 6030 and METGLAS 2605 SC,' Journal of Magnetism & Magnetic Materials, Vol. 111, No. 3, pp. 260-272 https://doi.org/10.1016/0304-8853(92)91085-8
  5. Wenham, S. R., Chan, B. O., Honsberg, C. B., 1997, 'Green MA. Beneficial and Constraining Effects of Laser Scribing in Buried-contact Solar Cells,' Journal of Progress in Photovoltaics : Research & Applications, Vol. 5, No. 2, pp. 131-137 https://doi.org/10.1002/(SICI)1099-159X(199703/04)5:2<131::AID-PIP162>3.0.CO;2-N
  6. Wang, A., Zhao, J., and Green, M. A., 1990, '24% Efficient Silicon Solar Cells,' Appl. Phys. Lett., Vol. 57, No. 602
  7. Subramanian, K., Ramanath, S. and Tricard, M., 1997, 'Mechanism of Material Removal in the Pression Production Grinding of Ceramics,' Journal of Manufacturing science and Engineering, Vol. 119, pp. 509-519 https://doi.org/10.1115/1.2831181
  8. Avagliano, S., Bianco, N., Manca, O., Naso, V., 1999, 'Combined thermal and optical analysis of laser back-scribing for amorphous-silicon photovoltaic cells processing,' International Journal of Heat and Mass Transfer, Vol. 42, No. 4, pp. 645-656 https://doi.org/10.1016/S0017-9310(98)00200-2
  9. Oklobdzija, V. G. and Barnes, E. R., 1988, 'On Implementing Addition in VLSI Technology,' IBM T. J. Watson Research Center
  10. Assembly Technology, 2000, 'Dicing Saw Cuts Wafers Easily, Accurately,' Machine Design, Vol. 66, No. 13
  11. Ko, K. Y., Cha, Y. Y. and Choi, B. S., 2000, 'Wafer Dicing State Monitoring by Signal Processing,' Journal of the Korean Society of Precision Engineering, Vol. 17, No. 5, pp. 70-75
  12. Ko, K. Y., Cha, Y. Y. and Choi, B. S., 2000, 'Monitoring of Wafer Dicing State by Using Back Propagation Algorithm,' Journal of Control Automation and Systems Engineering, Vol. 6, No. 6, pp. 486-491
  13. Hassui, A., Diniz, A. E., et al., 1998, 'Experimental Evaluation on Grinding Wheel Wear through Vibration and Acoustic Emission,' Wear, Vol. 217, pp. 7-14 https://doi.org/10.1016/S0043-1648(98)00166-5