압전특성을 이용한 접착 조인트의 안전성 모니터링

Reliability Monitoring of Adhesive Joints by Piezoelectricity

  • 권재욱 (LG전자 디지털 디스플레이연구소) ;
  • 진우석 (한국과학기술원 기계공학과) ;
  • 이대길 (한국과학기술원 기계공학과)
  • 발행 : 2003.08.01


Since the reliability of adhesively bonded joints for composite structures is dependent on many parameters such as the shape and dimensions of joints, type of applied load, and environment, so an accurate estimation of the fatigue life of adhesively bonded joints is seldom possible, which necessitates an in-situ reliability monitoring of the joints during the operation of structures. In this study, a self-sensor method for adhesively bonded joints was devised, in which the adhesive used works as a piezoelectric material to send changing signals depending on the integrity of the joint. From the investigation, it was found that the electric charge increased gradually as cracks initiated and propagated in the adhesive layer, and had its maximum value when the adhesively bonded joint failed. So it is feasible to monitor the integrity of the joint during its lifetime. Finally, a relationship between the piezoelectric property of the adhesive and crack propagation was obtained from the experimental results.


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