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A Dynamic Thermal Modeling of Chemical Mechanical Polishing Process

화학기계적 연마 프로세스의 동적 열전달 모델링 연구

  • Published : 2004.05.01

Abstract

This paper describes a dynamic thermal model for a representative dual axis rotational Chemical-Mechanical Polishing (CMP) tool. The model is one-dimensional but configured in the two-dimensional space and consists of three sub-models (pad, wafer and slurry fluid), with the first and the second that are time-dependent heat conduction-convection models with linear stationary (wafer) and nonlinear moving (pad) boundary conditions, and the last one that is a heat transport-convection model (slurry fluid). The modeling approach is validated by comparing the simulation results with available experimental data.

Keywords

CMP;Dynamic Thermal Modeling;Material Removal Model;Transient Thermal Analysis

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