Thermal Fatigue Reliability of Solder Joints in a Thin Film Optical Filter Device

박막 광학 필터 디바이스의 패키징시 솔더 조인트의 피로 신뢰성 해석

  • 이성철 (포항공과대학교 대학원) ;
  • 현충민 (포항공과대학교 대학) ;
  • 이형만 (광부품연구센터, 전자부품연구) ;
  • 김명진 (광부품연구센터, 전자부품연구) ;
  • 김회경 (광부품연구센터, 전자부품연구) ;
  • 김기태 (포항공과대학교 기계공학과)
  • Published : 2004.06.01


Plastic and creep deformations of solder joints during thermal cycling are the main factors of misalignments and power losses in optical telecommunication components. Furthermore, the increased mismatch between solder Joint-bonded areas may cause severe failure in the components. Darveaux's creep model was implemented into a finite element program (ABAQUS) to simulate creep response of solder. Based on the finite element results, thermal fatigue reliability was predicted by using various fatigue life prediction models. Also, the effects of ramp conditions, dwelling time, and solder joint-embedding materials on the reliability were investigated under the thermal cycling conditions of the Telcordia schedule (-40∼75$^{\circ}C$).


Fatigue Life Analysis;Fatigue Reliability;Finite Element Analysis;Optical Thin Film Filter;Solder Joint


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