Application of Stress Optimization for Preventing the Delamination of the Plastic IC Package in Reflow Soldering Process

리플로 납땜과정에서 플라스틱 IC 패키지의 박리방지를 위한 응력최적설계의 적용

  • 김근우 (연세대학교 기계공학부) ;
  • 이강용 (연세대학교 기계공학부) ;
  • 김옥환 (천안공업대학 플랜트설계)
  • Published : 2004.06.01


In order to prevent the interface delamination of an plastic IC package in the infrared (IR) soldering process, we tried to reduce stress by parameterization, sensitivity analysis and unconstraint optimization. The design variables of dimensions and material properties are determined among all the possible variables from the parametric study. Their optimized values are determined by applying the unconstraint optimization to the parameterized IC package. The maximum von-Mises stress value decreases greatly by optimum design.


Plastic IC Package;Thermal Loading;DOE;Unconstraint Optimization


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