A Study on the Convective Heat Transfer in Micro Heat Exchanger Embedded in Stacked Multi-Chip Modules

적층형 Multi-Chip Module(MCM) 내부에 삽입된 초소형 열교환기 내에서의 대류 열전달 현상에 대한 연구

  • 신중한 (서울대학교 기계항공공학부) ;
  • 강문구 (서울대학교 기계항공공학) ;
  • 이우일 (서울대학교 전기컴퓨터공학부)
  • Published : 2004.06.01


This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of micro-channels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules. In the numerical analysis, a parametric study was carried out for the parameters affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular micro-channels. In the experimental study, the cooling performance of the micro heat exchanger was tested on prototypes of stacked multi-chip modules with difference channel dimensions. The simulation results and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.


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