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Co-Firing of Low- and Middle- Permittivity Dielectric Tapes of Fabricating Low-Temperature Co-Fired Ceramics

LTCC용 저/중유전율 유전체 후막의 동시소성

  • Choi Young-Jin (Multifunctional Ceramics Research Center, Korea Institute of Science and Technology, Department of Materials Science and Engineering, Korea University) ;
  • Park Jeong-Hyun (Multifunctional Ceramics Research Center, Korea Institute of Science and Technology, Department of Materials Science and Engineering, Korea University) ;
  • Ko Won-Jun (Multifunctional Ceramics Research Center, Korea Institute of Science and Technology, Department of Materials Science and Engineering, Korea University) ;
  • Park Jae-Hwan (Multifunctional Ceramics Research Center, Korea Institute of Science and Technology) ;
  • Nahm Sahn (Department of Materials Science and Engineering, Korea University) ;
  • Park Jae-Gwan (Multifunctional Ceramics Research Center, Korea Institute of Science and Technology)
  • 최영진 (한국과학기술연구원 복합기능세라믹스 연구센터, 고려대학교 재료공학과) ;
  • 박정현 (한국과학기술연구원 복합기능세라믹스 연구센터, 고려대학교 재료공학과) ;
  • 고원준 (한국과학기술연구원 복합기능세라믹스 연구센터, 고려대학교 재료공학과) ;
  • 박재환 (한국과학기술연구원 복합기능세라믹스 연구센터) ;
  • 남산 (고려대학교 재료공학과) ;
  • 박재관 (한국과학기술연구원 복합기능세라믹스 연구센터)
  • Published : 2004.10.01

Abstract

Herein, we report on the co-firing of a low-K wiring substrate and a middle-K functional substrate in LTCC. Firstly, we researched the sintering behavior and dielectric properties of the low-k wiring substrate comprised by alumina and glass frit with ${\varepsilon}_r$, of $\sim7$ and the middle-k functional substrate comprised by $Ba_{5}Nb_{4}O_{15}$ and glass frit with ${\varepsilon}_r$, of $20\sim30$. The warpage and delamination between the hetero layers of the low-K and the middle-K composition were also studied. In particular, physical matching of the hetero layers could be possible by adjusting of the sintering properties of the composition. We observed that an introduction of the glass frit to the low- and middle-K substrate gives rise to a minimization of an effect given by separation of the hetero layers, and modification of the fraction of the glass frit accompanied by a variation of the composition could control the sintering behavior and its beginning temperature. In the case of co-firing of the L03 as the low-K wiring substrate composition and the M03 as the middle-K functional substrate composition at $875^{\circ}C$, we could fabricate a desirable structure of hetero layers without any kinds of structural defects such as separation, warpage, delamination, pore trap, etc. We suppose that the co-firing techniques described in this study would provide a helpful method to fabricate a LTCC multi-functional for the next generation.

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