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A Multi-chip Microelectrofluidic Bench for Modular Fluidic and Electrical Interconnections

전기 및 유체 동시접속이 가능한 멀티칩 미소전기유체통합벤치의 설계, 제작 및 성능시험

  • 장성환 (한국과학기술원 바이오시스템학과, 디지털나노구동연구단) ;
  • 석상도 (한국과학기술원 바이오시스템학과, 디지털나노구동연구단) ;
  • 조영호 (한국과학기술원 바이오시스템학과 및 기계공학과, 디지털나노구동연구단)
  • Published : 2006.04.01

Abstract

We present the design, fabrication, and characterization of a multi-chip microelectrofluidic bench, achieving both electrical and fluidic interconnections with a simple, low-loss and low-temperature electrofluidic interconnection method. We design 4-chip microelectrofluidic bench, having three electrical pads and two fluidic I/O ports. Each device chip, having three electrical interconnections and a pair of two fluidic I/O interconnections, can be assembled to the microelectofluidic bench with electrical and fluidic interconnections. In the fluidic and electrical characterization, we measure the average pressure drop of $13.6{\sim}125.4$ Pa/mm with the nonlinearity of 3.1 % for the flow-rates of $10{\sim}100{\mu}l/min$ in the fluidic line. The pressure drop per fluidic interconnection is measured as 0.19kPa. Experimentally, there are no significant differences in pressure drops between straight channels and elbow channels. The measured average electrical resistance is $0.26{\Omega}/mm$ in the electrical line. The electrical resistance per each electrical interconnection is measured as $0.64{\Omega}$. Mechanically, the maximum pressure, where the microelectrofluidic bench endures, reaches up to $115{\pm}11kPa$.

Keywords

Microelectrofluidic Bench;Multi-chip System;Micro-fluidic Modules;Electrofluidic Interconnection;Low-loss Interconnection;Low-temperature Assembly

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