Development of a Material Mixing Method for Topology Optimization of PCB Substrate

PCB판의 위상 최적화를 위한 재료혼합법의 개발

  • 한석영 (한양대학교 기계공학부) ;
  • 김민수 (한양대학교 일반대학원 기계공학과) ;
  • 황준성 (한양대학교 일반대학원 기계공학과) ;
  • 박재용 (한양대학교 일반대학원 기계공학과) ;
  • 최상혁 (한양대학교 일반대학원 기계공학과) ;
  • 이병주 (한양대학교 전자컴퓨터공학부)
  • Published : 2007.02.15


A material mixing method to obtain an optimal topology for a structure in a thermal environment was suggested. This method is based on Evolutionary Structural Optimization(ESO). The proposed material mixing method extends the ESO method to a mixing several materials for a structure in the multicriteria optimization of thermal flux and thermal stress. To do this, the multiobjective optimization technique was implemented. The overall efficiency of material usage was measured in terms of the combination of thermal stress levels and heat flux densities by using a combination strategy with weighting factors. Also, a smoothing scheme was implemented to suppress the checkerboard pattern in the procedure of topology optimization. It is concluded that ESO method with a smoothing scheme is effectively applied to topology optimization. Optimal topologies having multiple thermal criteria for a printed circuit board(PCB) substrate were presented to illustrate validity of the suggested material mixing method. It was found that the suggested method works very well for the multicriteria topology optimization.


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