Material Parameters Identification of Adhesive in Layered Plates Using Moiré Interferomety and Optimization Technique

무아레 간섭계 측정과 최적화 기법을 이용한 적층판의 접착제 물성치 규명

  • 주진원 (충북대학교, 기계공학부) ;
  • 김한준 (충북대학교 대학원 기계공학과) ;
  • 이우혁 (한국항공대학교, 항공우주 및 기계공학부) ;
  • 김진영 (한국항공대학교, 항공우주 및 기계공학부) ;
  • 최주호 (한국항공대학교, 항공우주 및 기계공학부)
  • Published : 2007.11.01


In this study, a method to characterize material properties of adhesive that is used in a layered plates bonding process is developed by combined evaluation of experiment, simulation and optimization technique. A small bonded specimens of rectangular plate are prepared to this end, and put into a thermal loading conditions. $Moir{\acute{e}}$ interferomety is used to measure submicron displacements occurred during the process. The elevated temperature is chosen as control factors. FE analysis with constant values for the adhesive materials is also carried out to simulate the experiment. Significant differences are observed from the two results, in which the simulation predicts the monotonic increase of the bending displacement whereas the measurement shows decrease of the displacement at above $75^{\circ}C$. In order to minimize the difference of the two, material parameters of the adhesive at a number of different temperatures are posed as unknowns to be determined, and optimization is conducted. As a result, optimum material parameters are found that excellently matches the simulation and experiment, which are decreased with respect to the temperature.


Layered Plates;$Moir{\acute{e}}$ Interferometry;Optimization;Material Parameter Identification;Adhesive


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