Development of Rapid Mask Fabrication Technology for Micro-abrasive Jet Machining

미세입자 분사가공을 위한 쾌속 마스크 제작기술의 개발

  • 이승표 (충북대학교 대학원 정밀기계공학과) ;
  • 고태조 (영남대학교 기계공학부) ;
  • 강현욱 (포항공과대학교 기계공학과) ;
  • 조동우 (포항공과대학교 기계공학과) ;
  • 이인환 (충북대학교 기계공학부)
  • Published : 2008.01.01


Micro-machining of a brittle material such as glass, silicon, etc., is important in micro fabrication. Particularly, micro-abrasive jet machining (${\mu}-AJM$) has become a useful technique for micro-machining of such materials. The ${\mu}-AJM$ process is mainly based on the erosion of a mask which protects brittle substrate against high velocity of micro-particle. Therefore, fabrication of an adequate mask is very important. Generally, for the fabrication of a mask in the ${\mu}-AJM$ process, a photomask based on the semi-conductor fabrication process was used. In this research a rapid mask fabrication technology has been developed for the ${\mu}-AJM$. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Two kinds of mask patterns were fabricated using SU-8 and photopolymer (Watershed 11110). Using fabricated mask patterns, abrasive-jet machining of Si wafer were conducted successfully.


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