An Effective Mitigation Method on the EMI Effects by Splitting of a Return Current Plane

귀환 전류 평면의 분할에 기인하는 복사 방출 영향의 효과적인 대책 방법

  • Jung, Ki-Bum (Korea Radio Promotion Association, EMC Center) ;
  • Jun, Chang-Han (Korea Radio Promotion Association, EMC Center) ;
  • Chung, Yeon-Choon (Department of Information & Communication Engineering, Seokyeong University)
  • 정기범 (한국전파진흥협회 EMC기술지원센터) ;
  • 전창한 (한국전파진흥협회 EMC기술지원센터) ;
  • 정연춘 (서경대학교 정보통신공학과)
  • Published : 2008.03.31


Generally a return current plane(RCP) of high speed digital and analog part is partitioned. This is achieved in order to decrease the noise interference between subsystem in PCBs(Printed Circuit Boards). However, when the connected signal line exists between each subsystem, this partition will cause unwanted effects. In a EMI(Electromagnetic Interference) point of view, the partition of the return current plane becomes a primary factor to increase the radiated emission. Component bridge(CB) is used for the way of maintaining radiated emission, still specific user's guide doesn't give sufficient principle. In a view point of EMI, design principle of multi-CB using method will be analyzed by measurement. And design principle of noise mitigation will be provided. Generally interval of multi-CB is ${\lambda}/20$ ferrite bead. In this study, When multi-CB connection is applied, design principle of ferrite bead and chip resistor is proved by measurement. Multi-connected chip resistance$(0{\Omega})$ is proved to be more effective design method in the point of EMI.


Return Curent Plane(RCP);EMI;Component Bridge(CB);PCBs


  1. Y. Ko, K. Ito, J. Kudo, and T. Sudo, 'Electromagnetic radiation properties of a printed circuit board with a slot in the ground plane', IEEE Int'l. Symp. Electromagnetic Comp., 1999
  2. Tae Hong Kim, Junho Lee, Hyungsoo Kim, and Joungho Kim, '3 GHz wide frequency model of ferrite bead for power/ground noise simulation of high-speed PCB', Electrical Performance of Electronic Packaging, pp. 21-23, Oct. 2002
  3. T. Hubing, 'PCB EMC design guidelines: A brief annotated list', Proc. of the 2003 IEEE Int'l. Symp. EMC, Boston, MA, pp. 34-37, Aug. 2003
  4. Jinkook Kim, Heeseok Lee, and Joungho Kim, 'Effect on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards', IEEE Trans. on Advanced Packaging, vol. 28, no. 4, Nov. 2005
  5. K. Armstrong, 'Advanced PCB design and layout for EMC-Part 2: Segregation and interface suppression', EMC&Compliance Journal, pp. 32-42, May 2004