Bending Effects of ITO Thin Film Deposited on the Polymer Substrate

고분자 기판에 증착한 ITO 박막의 Bending 효과

  • 김상모 (경원대학교 전기공학과) ;
  • 임유승 (경원대학교 전기공학과) ;
  • 최형욱 (경원대학교 전기공학과) ;
  • 최명규 (경원대학교 전기공학과) ;
  • 김경환 (경원대학교 전기공학과)
  • Published : 2008.07.01


ITO thin film was deposited on PC substrate in Facing Targets Sputtering (FTS) system with various sputtering conditions. After it is applied to external bending force, we investigated how change the surface and electrical property of as-deposited ITO thin film. As the L(face-plate distance) of substrate decreases, it found that the maximum crack density is increasing at the center position and decreasing crack density as goes to the edge. So to apply same curvature (r) and bending force to PC substrate with ITO thin film, we fixed the L that is equal to curvature radius (2r). Before bending test, ITO thin films that deposited in the input current of 0.4 A and thickness of 200 nm already had biaxial tensile failure because of each different CTE (Coefficient of Thermal Expansion) and Others had been shown no bending or crack. After bending test, all samples had been shown cracks at about 200 times and as increasing the crack density, resistivity increased.



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