Design and Fabrication of the System in Package for the Digital Broadcasting Receiver

디지털 방송 수신용 System in Package 설계 및 제작

  • 김지균 (명지대 공대 전기공학과) ;
  • 이헌용 (명지대 공대 전기공학과)
  • Published : 2009.01.01

Abstract

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

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