Study on Soft Etching Material Development to Improve Peel Strength between Surface of Copper and Solder Resist Ink

구리 표면과 Solder Resist Ink 사이의 밀착력 향상 위한 Soft Etching제 개발을 위한 연구

  • Kang, Yun-Jae (Department of Chemical Engineering & Biotechnology, Korea polytechnic University) ;
  • Hong, Min-Eui (ITMC) ;
  • Kim, Duk-Hyun (Department of Chemical Engineering & Biotechnology, Korea polytechnic University)
  • 강윤재 (한국산업기술대학교 생명화학공학과) ;
  • 홍민의 ((주)ITMC) ;
  • 김덕현 (한국산업기술대학교 생명화학공학과)
  • Received : 2009.01.08
  • Accepted : 2009.02.04
  • Published : 2009.04.10

Abstract

In this research, we defined the basic structure of soft etching material as $H_2SO_4/H_2O_2$, and used additives as inhibitor, surfactant, and stabilizer. By analyzing influence to surface roughness and change of etching rate related to type and density of additives, we research to develop soft etching material having the same adhesiveness as existing etching material. As a result of research, it is estimated that after densities of $H_2O_2$ and $H_2SO_4$ are 3%, 4% respectively, 500 ppm of amine type 5-Azol, as inhibitor, and 600 ppm of PEI, as surfactant, and 10 ppm of phosphoric acid, as stabilizer, are added, is the most reasonable surface roughness and etching rate. As result of solder test, it is estimated that solder resist ink did not peel away or curl up and have reliable adhesiveness.

Acknowledgement

Supported by : 중소기업청, 한국산업기술대학교, (주)ITMC

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