The Effect of Finite Element Models in Thermal Analysis of Electronic Packages

반도체 패키지의 열변형 해석 시 유한요소 모델의 영향

  • 최남진 (충북대학교 대학원 기계공학과) ;
  • 주진원 (충북대학교 기계공학부)
  • Published : 2009.04.01


The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.


FC-PBGA Package;Thermal Deformation Analysis;Finite Element Model;Viscoplastic Analysis


  1. Darveaux, R. and Mawer, A., 1995, 'Thermal and Power Cycle Limit of Plastic Ball Grid Array (PBGA) Assemblies,' Proc. Surface Mount Int. Conf., pp. 315-326
  2. Lee, T., Lee, J. and Jung, I., 1998, 'Finite Element Analysis for Solder Ball Failures in Chip Scale Packages,' Microelectronics and Reliability, Vol.38, No. 12, pp. 1941-1947
  3. Chen, S. C., Lin, Y. C. and Cheng, C. H., 2006, The Numerical Analysis of Strain Behavior at the Solder Joint and Interface in a Flip Chip Package,' J. Materials Processing Technology, Vol. 171, pp. 125-131
  4. Joo, J. and Cho, S., 2004, 'Evaluation of thermal Deformation Model for BGA Packages Using Moire Interferometry,' KSME International Journal, Vol. 14, No. 2, pp. 230-239
  5. Han, B., 1998, 'Recent Advancements of Moire and Microscopic Moire Interferometry for Thermal Deformation Analysis of Microelectronics Devices,' Experimental Mechanics, Vol.38, No.4, pp. 278-288
  6. Joo, J. W. and Han, B. T., 2002, 'Thermo-Mechanical and Flexural Analysis of WB-PBGA Package Using Moiré Interferometry,' Transactions of the KSME(A), Vol.26, No.7, pp. 1302-1308
  7. Cho, S.-M., Cho. S.-Y. and Han, B., 2002, 'Observing Real-Time Thermal Deformations in Electronic Packaging,' Experimental Techniques, Vol. 26, No. 3, pp. 25-29
  8. Pang, J. H., Seetoh, C. W., and Wang, Z. P., 2000, 'CBGA Solder Joint Reliability Evaluation Based on Elastic Plastic Creep Analysis,' ASME J. Electron. Packag., Vol. 122, Issue 3, pp. 255-261
  9. Jung, W., Lau, J. H. and Pao, Y. H., 1996, 'Nonlinear Analysis of Full-matrix and Permeter Plastic Ball Grid Array Solder Joint,' Proc. 1996 ASME Intrnl Mech. Eng. Congress & Exhi., Atlanta, Nov., 96-WA/EEP-17, pp. 1-19
  10. Anand, L., 1982, 'Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperatures,' ASME J. Engineering Material Technology, Vol. 104, pp. 12-17
  11. Darveaux, R., 1997, 'Solder joint fatigue life model,' Proceedings of 1997 TMS Annual Meeting, pp. 213-218
  12. Ye, H., Lin, M. and Basaran, C., 2002, 'Failure Modes and FEM Analysis of Power Electronic Packaging,' Finite Elements in Analysis and Design, Vol. 38, Issue.7, pp. 601-612
  13. Wang, G. Z., Cheng, Z. N., Becker, K., and Wilde, J., 2001, 'Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys,' J. Electronic Packaging, Trans. ASME, Vol. 123, No. 3, pp. 247-253
  14. Skipor, A. F., Harren, S.V. and Botsis, J., 1996, 'On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder,' ASME. J. Eng. Mater. Technol., Vol. 118, pp. 1-11
  15. Pang, J. H. L, Chong, D. Y. R and Low, T. H., 2001, 'Thermal Cycling Analysis of Flip-Chip Solder Joint Reliability,' IEEE Trans. Comp. & Pack. Technol. Vol. 24, No. 4, pp. 705-712
  16. Joo, J. W., Cho, S. and Han, B., 2005, 'Characterization of Flexural and Thermo mechanical Behavior of Plastic Ball Grid Package Assembly Using Moire Interferometry,' Microelectronics Reliability, Vol. 45, Iss. 4, pp. 637-646

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