DOI QR코드

DOI QR Code

Optimal Design of Dummy Patterns for Minimizing PCB Warpage

PCB 휨의 최소를 위한 더미 패턴의 최적 설계

  • 이상혁 (서울산업대학교 나노아이티공학과) ;
  • 김선경 (서울산업대학교 금형설계학과)
  • Published : 2009.06.01

Abstract

In this work, a design method that minimizes PCB warpage is proposed. This work suggests that narrow dummy patterns are placed on the discetized location along the periphery of the PCB to control the warpage. The warpage is numerically simulated base on direct modeling of PCB patterns. The optimal pattern that minimizes warpage is determined using the human-based genetic algorithm.

Keywords

Genetic Algorithm;PCB;Warpage

References

  1. Ding, H. I., Ume, C., Powell, R. E. and Hanna, C. R., 2005, 'Parametric Study of Warpage in Printed Wiring Board Assemblies, Components and Packaging Technologies,' IEEE Transactions on, Vol. 28, No. 3, p. 517 https://doi.org/10.1109/TCAPT.2005.848570
  2. Hutapea, P., Grenestedt, J. L., Modi, M., Mello, M., and Frutschy, K., 2006, ' Prediction of Microelectronic Substrate Warpage Using Homogenized Finite Element Models,' Microelectronic Engineering 83, pp 557-569 https://doi.org/10.1016/j.mee.2005.12.009
  3. Hutapea, P. and Grenestedt, J. L., 2003, 'Influence of Electric Artwork on Thermomechanical Properties and Warpage of Printed Circuit Boards,' Journal of Applied Physics, Vol. 94. No. 1, pp 686-696 https://doi.org/10.1063/1.1580645
  4. Kim, S. J., Sohn, E. S., Wang, G. H., Son, S. J., Chung, K. S. and Lee, C. H., 2001, 'A Study on the Effectiveness of Dummy Pattern Design Existence in Multi Layer PBGA Application,' 2001 Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.2001.928030
  5. Moaveni, S., 1999, 'Finite Element Analysis, Theory and Application with Ansys,' Prentice Hall, Upper Saddle River, NJ
  6. http://en.wikipedia.org/wiki/Genetic_algorithms
  7. http://hbga.org/hbga.html
  8. Rao R. Tummala, 2001, 'Microsystems Packaging,' McGraw Hill, pp. 879-923
  9. Lee, M., 1998, 'Finite Element Modeling of Printed Circuit Boards (PCBs) for Structural Analysis,' Soldering & Surface Mount, Vol. 10, No. 3, pp. 12-17 https://doi.org/10.1108/09540919810237039