Optimal Design of Dummy Patterns for Minimizing PCB Warpage

PCB 휨의 최소를 위한 더미 패턴의 최적 설계

  • 이상혁 (서울산업대학교 나노아이티공학과) ;
  • 김선경 (서울산업대학교 금형설계학과)
  • Published : 2009.06.01


In this work, a design method that minimizes PCB warpage is proposed. This work suggests that narrow dummy patterns are placed on the discetized location along the periphery of the PCB to control the warpage. The warpage is numerically simulated base on direct modeling of PCB patterns. The optimal pattern that minimizes warpage is determined using the human-based genetic algorithm.


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