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Fatigue Limit of Copper Film

동 박막의 피로한도

  • 허용학 (한국표준과학연구원 산업측정표준본부) ;
  • 김동진 (한국표준과학연구원) ;
  • 이해무 (한국표준과학연구원) ;
  • 홍성구 (한국표준과학연구원) ;
  • 박준협 (동명대학교 메카트로닉스공학과)
  • Published : 2009.10.01

Abstract

Fatigue limit of the copper film coated by Sn was estimated using Goodman diagram and Gerber diagram. To obtain the high cycle fatigue life curve, S-N curve, of the film, the high cycle fatigue test was carried out by applying the constant amplitude load to the film specimen with three different stress ratio of 0.05, 0.3 and 0.5 and the frequency of 40 Hz at room temperature in air. The free-standing film specimen 15.26${\mu}m$ thick was fabricated by etching process. The fatigue limits and S-N curves at the respective stress ratios were determined from the experimental works. It was shown that the S-N curves were dependent on the stress ratio and the fatigue limit was increased with decreasing the stress ratio. The dependency of the fatigue behavior was presented in empirical relationship. Using these relationships, the fatigue limit was predicted.

Keywords

High Cycle Fatigue;Copper Film;Stress Ratio;S-N Curve;Fatigue Limit

References

  1. Spearing, S. M., 2000, 'Materials Issues in Micro Electromechanical Systems,' Acta Materialia, 48, pp. 179-196 https://doi.org/10.1016/S1359-6454(99)00294-3
  2. Nix, W. D., 1989,' Mechanical Properties of Thin Films,' Metall. Trans. 20A, pp.2217-2245
  3. Vinci,R. P. and Vlassak, J. J., 1996,'Mechanical Behavior of Thin Films,' Ann. Rev. Mater. Sci., 26, pp.431-462 https://doi.org/10.1146/annurev.ms.26.080196.002243
  4. Sharpe, W.N. and Bagdahn, J., 2004,'Fatigue Testing of Polysilicon-A Review,' Mech. and Mater. 38, pp. 3-11 https://doi.org/10.1016/S0167-6636(03)00027-9
  5. Park, J.-H., An, J.-H., Kim, Y.-J., Huh, Y.-H. and Lee, H.-J.,2008, 'Tensile and High Cycle Fatigue Test of Copper Thin Film,' Mat.-wiss. u. Werkstofftech. 39, No. 2 pp.187-192 https://doi.org/10.1002/mawe.200700262
  6. Huh, Y-H, Kim, D.I., Kim, D.J., Park, P., Kee C.D. and Park, J-H., 2004, 'Application of Micro-ESPI Technique for Measurement of Micro-Tensile -74 Properties,' Key Eng. Materials 270, 744-747 https://doi.org/10.4028/www.scientific.net/KEM.270-273.744
  7. Kraft, O. and Volkert, C.A., 2001,'Mechanical Testing of Thin Films and Small Structures,' Adv. Eng. Mater.3, pp. 99-110 https://doi.org/10.1002/1527-2648(200103)3:3<99::AID-ADEM99>3.0.CO;2-2
  8. Jun-Hyub Park and Yun-Jae Kim, 2007, 'A Novel Tensile Specimen and Tensile Tester for Mechanical Properties of Thin Films,' Trans. of the KSME A, 31, No. 6, pp. 644-650 https://doi.org/10.3795/KSME-A.2007.31.6.644