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Fracture Behavior of Glass/Resin/Glass Sandwich Structures with Different Resin Thicknesses

서로 다른 레진 두께를 갖는 유리/레진/유리샌드위치 구조의 파괴거동

  • 박재홍 (국민대학교 기계시스템공학부) ;
  • 이유진 (국민대학교 기계시스템공학부) ;
  • 김태우 (국민대학교 기계시스템공학부) ;
  • 임홍재 (국민대학교 자동차공학과) ;
  • 이기성 (국민대학교 기계시스템공학부)
  • Received : 2010.05.25
  • Accepted : 2010.11.02
  • Published : 2010.12.01

Abstract

Glass/resin/glass laminate structures are used in the automobile, biological, and display industries. The sandwich structures are used in the micro/nanoimprint process to fabricate a variety of functional components and devices in fields such as display, optics, MEMS, and bioindustry. In the process, micrometer- or nanometer-scale patterns are transferred onto the substrate using UV curing resins. The demodling process has an important impact on productivity. In this study, we investigated the fracture behavior of glass/resin/glass laminates fabricated via UV curing. We performed measurements of the adhesion force and the interfacial energy between the mold and resin materials using the four-point flexural test. The bending-test measurements and the load-displacement curves of the laminates indicate that the fracture behavior is influenced by the interfacial energy between the mold and resin and the resin thickness.

Keywords

Nanoimprint Lithography;4-Point Bending Test;Resin;Glass;Fracture;Interface Release Rate;Interfacial Energy;Crack Deflection

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