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Modeling for New Type Backlight Units

신개념 백라이트유닛 모델링

  • Lee, Kwang-Hoon (Department of Advanced Fusion Technology, Konkuk University) ;
  • Jee, Seung-Hyun (Department of Material Science & Engineering, Yonsei University) ;
  • Kim, Soo-Hyun (Department of Material Science & Engineering, Yonsei University) ;
  • Yoon, Young-Soo (Department of Material Science & Engineering, Yonsei University) ;
  • Kim, Soo-Ho (GS nanotech, Caltex New Energy Development Center)
  • 이광훈 (건국대학교 신기술융합학과) ;
  • 지승현 (연세대학교 신소재공학과) ;
  • 김수현 (연세대학교 신소재공학과) ;
  • 윤영수 (연세대학교 신소재공학과) ;
  • 김수호 (GS칼텍스 신에너지연구센터 GS나노텍)
  • Received : 2009.12.14
  • Accepted : 2010.03.15
  • Published : 2010.04.25

Abstract

In order to obtain thinner and brighter backlight units (BLU), we simulated a new-type backlight unit. A micro-lens array sheet was formed on the upper plane of the light guide plate (LGP) comprising the backlight unit. Also, in order to match with the LGP, we simulated a functional optical sheet. The conventional BLU uses one LGP and four optical sheets, but we simulated a BLU that uses one optical sheet. Simulation results have revealed that our BLU can achieve the same luminance and 30% better view angle as compared with conventional ones.

References

  1. M. Anandan, “LCD Backlighting,” Society for Informational Display Seminar Lecture Notes, 169-250 (2002).
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  3. D. M. Brown, R. Dean, and J. D. Brown, “LED backlight : design, fabrication, and testing,” Proc. SPIE 3938, 180-187(2000).
  4. T. R. Jay, M. B. Stern, and R. E. Knowlden, “Effect of refractive microlens array fabrication parameters on optical quality,” Proc. SPIE 1751, 236-245 (1992).
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Cited by

  1. Simulation of Luminance and Uniformity of LGP According to the Laser Scattering Pattern vol.21, pp.6, 2010, https://doi.org/10.3807/KJOP.2010.21.6.225
  2. Study on the Optimization of the Optical Structure of Lenticular-Lens Films for LCD Backlight Applications vol.22, pp.6, 2011, https://doi.org/10.3807/KJOP.2011.22.6.247
  3. Development of Hybrid Machining System and Hybrid Process Technology for Ultra-fine Planing and Micro Punching vol.12, pp.6, 2013, https://doi.org/10.14775/ksmpe.2013.12.6.010