Influence of Hydrophobic Silica on Physical Properties of Epoxy Nanocomposites for Epoxy Molding Compounds

에폭시 몰딩 컴파운드를 위한 에폭시 나노복합재료의 소수성 실리카의 영향

  • Received : 2010.01.08
  • Accepted : 2010.01.20
  • Published : 2010.03.30


In this work, the effect of hydrophobic treated silica on the water absorption, thermal stabilities, and mechanical properties of the epoxy nanocomposites were investigated as a function of the silica content. As filler, fumed silica treated by dimethyldichlorosilane was used. It was found that the silica was well dispersed in the epoxy resins by the melt-mixing method with the addition of a silane coupling agent. The water absorption of the nanocomposites decreased with an increase of the silica content due to the effect of hydrophobic treated silica. The thermal properties, such as thermal degradation temperature, glass transition temperature ($T_g$), and coefficient of thermal expansion (CTE), of the nanocomposites were improved by the addition of silica. Furthermore, the mechanical properties of the nanocomposites, that is, the tensile strength and modulus, were enhanced with increasing silica content. This was attributed to the physically strong interaction between silica and epoxy resins.


  1. M. G. Pecht, R. Agarwal, P. McCluskey, S. Javadpour, and R. Mahajan, "Electronic Packaging", CRC Press, New York, 1999.
  2. L. Prezzi and L. Mascia, "Network density control in epoxy- silica hybrids by selective silane functionalization of precursors", Adv. Polym. Technol., 24, 91 (2005).
  3. J. H. Roh, J. H. Lee, N. I. Kim, H. M. Kang, T. H. Yoon, and K. H. Song, "DSC analysis of epoxy molding compound with plasma polymer-coated silica fillers", J. Appl. Polym. Sci., 90, 2508 (2003).
  4. Y. S. Chung, M. Y. Jeon, and C. K. Kim, "Fabrication of nearly monodispersed silica nanoparticles by using poly(1-vi-ny1- 2-pyrrolidinone) and their application to the preparation of nanocomposites", Macromol. Res., 17, 37 (2009).
  5. A. S. Patole, S. P. Patole, M. H. Song, J. Y. Yoon, J. H. Kim, and T.H. Kim, "Synthesis and characterization of silica/ polystyrene composite nanoparticles by in situ miniemulsion polymerization", Elastomers and Composites, 44, 34 (2009).
  6. C. Shao, H. Y. Kim, J. Gong, B. Ding, D. R. Lee, and S. J. Park, "Fiber mats of poly(vinyl alcohol)/silica composite via electrospinning", Mater. Lett., 57, 1579 (2003).
  7. S. M. Choi, E. K. Lee, and S. Y. Choi, "Effects of silane- treated silica on the cure temperature and mechanical properties of elastomeric epoxy", Elastomers and Composites, 43, 147 (2008).
  8. M. Ochi, R. Takahashi, and A. Terauchi, "Phase structure and mechanical and adhesion properties of epoxy/silica hybrids", Polymer, 42, 5151 (2001).
  9. G. Schiavon, J. G. Kuchler, B. Corain, and W. Hiller, "Force modulation atomic force microscopy as a powerful tool in organic-inorganic hybrid materials analysis", Adv. Mater., 13, 310 (2001).<310::AID-ADMA310>3.0.CO;2-C
  10. B. M. Novak, "Hybrid nanocomposite materials between inorganic glassed and organic polymers", Adv. Mater., 5, 422 (1993).
  11. P. L. Teh, M. Jaafar, H. M. Akil, K. N. Seetharamu, A. N. R. Wagiman, and K. S. Beh, "Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application", Polym. Adv. Technol., 19, 308 (2008).
  12. J. W. Bae, W. Kim, S. Hwang, Y. S. Choe, and S. H. Lee, "A low-viscousity, highly thermally conductive epoxy molding compound (EMC)", Macromol. Res., 12, 78 (2004).
  13. M. Yamaguchi, Y. Nakamura, and T. Iida, "Process induces fiber orientation: Numerical simulation with experimental verification", Polym. Compos., 6, 85 (1998)
  14. W. Zhang, A. A. Dehghani-Sanij, and R. S. Blackburn, "IR study on hydrogen bonding in epoxy resin-silica nanocomposites", Prog. Nat. Sci., 18, 801 (2008).
  15. L. Cheng, L. Zheng, G. Li, J. Zeng, and Q. Yin, "Influence of particle surface properties on the dielectric behavior of silica/epoxy nanocomposites", Physica B, 403, 2584 (2008).
  16. F. L. Jin, K. Y. Lee, and S. J. Park, "Surface treatment of montmorillonite on the thermal stabilities of bisphenol-A diglycidyl dimethacrylate nanocomposites", Mater. Sci. Eng. A, 435, 429 (2006).
  17. W. G. Kim and J. H. Ryu, "Physical properties of epoxy molding compound for semiconductor encapsulation according to the coupling treatment process change of silica", J. Appl. Polym. Sci., 65, 1975 (1997).<1975::AID-APP15>3.0.CO;2-W
  18. S. J. Park, F. L. Jin, and C. J. Lee, "Preparation and physical properties of hollow glass microspheres-reinforced epoxy matrix resins", Mater. Sci. Eng. A, 402, 335 (2005).
  19. F. L. Jin and S. J. Park, "Interfacial toughness properties of trifunctional epoxy resins/calcium carbonate nanocomposites", Mater. Sci. Eng. A, 475, 190 (2008).