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Study on Inverse Approach to Validation of Viscoplastic Model of Sn37Pb Solder and Identification of Model Parameters

Sn37Pb 솔더의 점소성 모델 검증 및 파라메터 추정을 위한 역접근법에 관한 연구

  • Gang, Jin-Hyuk (School of Aerospace and Mechanical Engineering, Korea Aerospace Univ.) ;
  • Lee, Bong-Hee (Dept. of Engineering Mechanics, Chungbuk Nat'l Univ.) ;
  • Choi, Joo-Ho (School of Aerospace and Mechanical Engineering, Korea Aerospace Univ.) ;
  • Joo, Jin-Won (Dept. of Engineering Mechanics, Chungbuk Nat'l Univ.)
  • 강진혁 (한국항공대학교 항공우주 및 기계공학부) ;
  • 이봉희 (충북대학교 기계공학과) ;
  • 최주호 (한국항공대학교 항공우주 및 기계공학부) ;
  • 주진원 (충북대학교 기계공학과)
  • Received : 2010.04.07
  • Accepted : 2010.07.16
  • Published : 2010.10.01

Abstract

The objective of this study is to determine the best material model that represents the deformation behavior of the Sn37Pb solder alloy accurately. First, a specimen is fabricated and subjected to a thermal cycle with temperatures ranging from the room temperature to $125^{\circ}C$. An experiment is conducted to examine deformation by Moire interferometry. Three different constitutive equation models are used in the finite element analysis (FEA) of the thermal cycle. In order to minimize the difference between the FEA results and the experimental results, the material parameters of the solder alloy are considered to be unknown and are determined by conducting optimization. As a result of the study, the Anand model is found to represent the deformation behavior of the solder most accurately.

Keywords

Sn-Pb Eutectic Solder;Creep;Viscoplasticity;Material Property Identification;Moir$\acute{e}$ Interferometry

Acknowledgement

Supported by : 한국과학재단

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