Thermal-Fluid Coupled Analysis for Injection Molding Process by Considering Thermal Contact Resistance

사출금형의 열접촉 저항을 고려한 성형과정의 열-유동 연계해석

  • Sohn, Dong-Hwi (Graduate School of NID Fusion Technology, Seoul Nat'l Univ. Sci. Tech.) ;
  • Kim, Kyung-Min (Graduate School of NID Fusion Technology, Seoul Nat'l Univ. Sci. Tech.) ;
  • Park, Keun (School of Mechanical and Automation Engineering, Seoul Nat'l Univ. Sci. Tech.)
  • 손동휘 (서울과학기술대학교 NID 융합기술대학원) ;
  • 김경민 (서울과학기술대학교 NID 융합기술대학원) ;
  • 박근 (서울과학기술대학교 기계설계자동화공학부)
  • Received : 2011.06.21
  • Accepted : 2011.08.16
  • Published : 2011.12.01


Injection molds are generally fabricated by assembling a number of plates in which the core and cavity components are assembled. This assembled structure has a number of contact interfaces where the heat transfer characteristics are affected by thermal contact resistance. In previous studies, numerical approaches were investigated to predict the effect of thermal contact resistance on the temperature distribution of injection molds. In this study, thermal-fluid coupled numerical analyses are performed to take into account the thermal contact effect on the numerical evaluation of the mold filling characteristics. Comparisons with experimental results show that the proposed coupled analysis provides more reliable results than the conventional analyses in predicting the mold filling characteristics by taking into account the effect of thermal contact resistance inside the injection mold assembly.


Injection Molding;Numerical Analysis;Thermal Contact Resistance;Thermal-Fluid Coupled Analysis


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