Design Optimization of a Heat Sink for Mobile Telecommunication Module Satisfying Temperature Limits

온도 제한조건을 고려한 이동통신 모듈의 히트싱크 최적설계

  • Jeong, Seung-Hyun (Graduate School of Mechanical Engineering, Hanyang Univ.) ;
  • Jeong, Hyun-Su (Dept. of Mechanical and Industrial Engineering, Hanyang Univ.) ;
  • Lee, Yong-Bin (Graduate School of Mechanical Engineering, Hanyang Univ.) ;
  • Choi, Dong-Hoon (The Center of Innovation Design Optimization Technology (iDOT), Hanyang Univ.)
  • 정승현 (한양대학교 기계공학과) ;
  • 정현수 (한양대학교 기계 및 산업공학과) ;
  • 이용빈 (한양대학교 기계공학과) ;
  • 최동훈 (한양대학교 최적설계신기술연구센터)
  • Received : 2010.07.20
  • Accepted : 2010.12.10
  • Published : 2011.02.01


As the number of mobile subscribers has increased recently, the demand for more number of base stations has increased. However, because of the shortage of sites for constructing base stations, a mobile communication module needs to be small in size. To minimize the size of the module, the size of the heat sink attached to the outside of the module should be minimized. Furthermore, the temperature of each electronic component of the module should be lower than the allowable temperature so that thermal stability can be maintained. A commercial PIDO (process integration and design optimization) tool PIAnO and a commercial CFD (computational fluid dynamics) tool FLOTHERM are used to minimize the size of the module while the constraints on the temperatures of the twelve electronic components are satisfied. As a result of design optimization, the volume of the heat sink is reduced by 41.9% while all the constraints on the temperature of the twelve electronic components of the module are satisfied.


Design Optimization;Heat Sink;Design of Experiments;Mobile Telecommunication


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